The wire harness manufacturers association and the ipc association connecting electronics industries combined forces to create the ipc whmaa620c requirements and acceptance for cable and wire harness assemblies which is an amazing resource for wire harness manufacturers. Dispositions include, but are not limited to, rework, use as is, scrap or repair. Ipc jstd001 cse blackfox premier training and certification. Ipc whmaa620 requirements and acceptance for cable and wire harness assemblies developed by the ipc task group 731f of the product assurance subcommittee 730 and the whma industry. Most of the times, even if the enduse of the product only requires class 1. Wire adds can create parasitic antennas for example.
The standard is a tool to establish level of quality and communicate quality acceptance criteria across industry. These standards govern what is considered acceptable in terms of build criteria for solder joints, heel fillets, component placement tolerance and any and all things related to building an electronic circuit card assembly. Demo only tthroughholehroughhole ssolder joint older. Over time, electronics manufacturing companies have increasingly relied on ipc a610 and ipc jstd001 to define what soldering conditions are acceptable. There is a new class called out in ipc 6012, class 3 a, which includes space and military avionics which is the highest class for printed circuits. Pth3g throughhole solder joint quality standards from.
Electronics industries requirements and acceptance. Differences between class 2 and class 3 electronic assemblies. Covers throughhole solder joint terminology, industry specifications for. Meeting the minimum ipc class 3 annular ring requirements requires that the pad size be large enough to accommodate the diameter of the via. Requirements for soldered electrical and electronic assemblies. Ipc checklist for producing rigid printed board assemblies. The class 1, 2 3 and 3 a specifications are called out in ipc 6012 rigid. I have always had in the back of my head that burnt flux is a defect for all class 3 assemblies. Often used as companion documents, ipc jstd001f and ipc a610f each has a unique purpose.
Issues of burnt flux on class 3 pcb assemblies question. Mil aero and medical applications typically require class 3 products. Wetting of component side land 0% a properly wetted solder joint on the top or component side land is not required minimum throughhole solder joint requirements class 3 shown below are the minimum acceptable conditions for a class 3 platedthrough. Criteria are given for each class in four levels of acceptance. Students have an opportunity to learn and develop the knowledge and hands on skill necessary to complete a solder connection that meets the ipc jstd001 acceptance criteria for class 3 assemblies. Can you give me a basic definition of the differences between class 2 and class 3 products and where these differences show up in the ipc.
Jan 15, 2020 many of samtecs products can meet ipca610 class 3 which is normally required when a product must have continued high performance in extreme harsh conditions. It would be pointless and uneconomical to call for a tv remote being built to be inspected to anything above class 1. This classification system was developed and is monitored by ipc under the ipc 6011 standard. Professional gold cup soldering ipc class 3 youtube. Circular fillet and wetting of solder of the lead and plated hole barrel on the solder side.
The categories reflect the level of quality of each circuit board type, from lowest class 1 standards to highest class 3 standards. All of the illustrations show the same solder connection from three different views. Ipcwhmaa620 wiring harness manufacturers association. Both of which i highly recommend against for class 3 applications for many reasons. Class 1 has the lower requirements and class 3 with the toughest requirements. We will make it class 2 just to ensure a better performance. Table 88 dimensional criteria butti joints not applicable to class 3. The ipc whmaa620 standard prescribes practices and requirements for the manufacture of cable, wire and harness assemblies. This program explains the requirements and acceptance criteria for ipca610g class 3 throughhole solder joints. The standard describes materials, methods, tests and acceptability criteria for producing crimped, mechanically secured and soldered interconnections, and the related assembly activities corresponding lacingrestraining criteria associated with cable and harness.
A defect for a class 1 product means that the characteristic is also a defect for class 2 and 3. Many of samtecs products can meet ipca610 class 3 which is normally required when a product must have continued high performance in extreme harsh conditions. Understanding ipc class 2 vs class 3 solder joints the samtec. Jan 23, 2018 this program explains the requirements and acceptance criteria for ipc a610g class 3 throughhole solder joints. Recommended for technicians with skills in basic soldering and component rework, but may be inexperienced in general repairrework procedures. The order of precedence contains that decision, the master drawing and at the bottom, ipc 610a. Jstd001 for soldering requirements and ipca610 for acceptability requirements. My company is confused about ipca610 class 2 and class 3. Understanding ipc class 2 vs class 3 solder joints the. A defect for class 1 automatically implies a defect for class 2 and 3. The hand soldering fundamentals class is designed to familiarize workers new to soldering with basic concepts, equipment and protocols. Optimizing soldervolume specifications for class 3 manufacturing.
Ipc 77117721b ipc a610e ipc whmaa620b ipc jstd001e ipc a600h all are available in a cis and a cit level all differentiate class 1, 2, 3 and space. When documents other than ipc a610 are cited, the order of precedence shall be defined in the procurement documents. Ipc a610 class for acceptability of electronic assemblies is the most widely used standard published by the ipc. Electronics assembly, ipc, jstd001, nasastd, training courses. Electronics assembly standards ipc jstd001 and ipca610. Voiding criteria in bgacsp component solder joints ipc blog. Production assembly line improve your workers basic skill set to improve their speed and quality of hand solder joints. In ipc a610 certification cis includes a handson section as part of inspection module related to pcb inspection. And, as more and more former manufacturers turn to contract manufacturers, the customer base also has accepted these ipc documents as gospel.
In electronics manufacturing, pcbs fall into 1 of 3 ipc class definitions that reflect the quality, from lowest class 1 to highest class 3 electronics. Various courses provide the understanding of todays industry standards and procedures such as ipc a610, jstd001, ipc 77117721 and ipc whmaa620. Techniques we teach in ipc jstd001 at circuit technology inc. Apply to electronics technician, senior manufacturing technician, senior manufacturing engineer and more. As a circuit board manufacturer, designers often ask us about the difference between ipc class 2 and class 3. Ipc courses ipc training and solder certification center. John gammell, master ipc trainer, demonstrates the gold cup. Class 3 increases the requirements in most areas of inspection for the solder joint over class 2. Containing highquality computer graphics, this poster depicts complex through hole solder joint requirements so clearly, that all operators and. When invoked by the customer or per contractual agreement, ipc a610. Ipc certification courses are an industry approved programs with international standard that is based on an industrywide ipc standards with quality solder training.
The initial reasoning behind the application of gold to printed circuit boards was to make them more susceptible to the application of wire bonding and for corrosion protection. John gammell, master ipc trainer, demonstrates how to solder chip and melf components to ipc class 3. Ipca610 and jstd001 standards state that greater than 25% of voiding in any ball in the xray image area is classified as a defect according to electronic product classifications. It was founded in 1957 as the institute of printed circuits. Parts shall be mounted in such a manner that, at a minimum, the markings are visible in the following order of precedence. Ipc 6012, certfied ipc specialist qualification and performance specification of printed rigid boards in addition ipc certification we also offer halffull day soldering courses for. Ipc classes, with regard to the assembly standard 610 are used to standardize the acceptability levels of electronics.
Minimum through hole solder joint requirements class 3. Target condition, acceptable condition, and either defect condition or process indicator. Jstd001 revision changes regarding the requirements for gold plating removal gold and electronics have had a partnership in products and components for many years. Ipca610 covers solder joints for varying types of connector termination styles, and has different classes of solder joints for varying apps. Requirements for soldered electrical and electronic assemblies depicting minimum end. Surface mount solder joint quality standards from ipc a610g class 3. Jun 26, 2018 as a circuit board manufacturer, designers often ask us about the difference between ipc class 2 and class 3. However, process indicators signal a lack of good workmanship to the customer and should be used to improve the manufacturing processeven though. Its name was later changed to the institute for interconnecting and packaging electronic circuits. Ipc 771112 has a lot of rework procedures and some of them can be pretty sketchy for high reliability and aerospace applications. Acceptable class 1, 2, 3 target class 1, 2, 3 process indicator class 1, 2, 3 defect class 1, 2, 3 a process indicator is a condition that does not affect the form, fit and function of a product. Apr 17, 2019 following ipc wire harness assembly standards offers tremendous benefits for wire harness manufacturers. These standards govern what is considered acceptable in terms of build criteria for solder joints, heel fillets, component placement tolerance. Percent of the land area covered with solder on component side.
Class 1 does exist although we rarely produce boards that fall into this classification. Optimizing soldervolume specifications for class 3. A1p2d3 is acceptable class 1, process indicator class 2 and defect class 3 n1d2d3 is requirement not establish class 1, defect classes 2 and 3 a1a2d3 is acceptable classes 1 and 2, defect class 3 d1d2d3 is defect for all classes. Oct 25, 2012 by jasbir bath, ipc principal engineer over the last few years, there have been many discussions on the affect of voiding on bgacsp solder joint reliability. Circular wetting of solder of the lead and plated hole barrel on the component side. If a product requires high spec and high reliability, class 3 would be advised. Class 2 and class 3 are workmanship standards as defined by ipca610 for building electronics assemblies.
Ipc, the association connecting electronics industries, is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. Best is a certified master ipc training and solder certification center offering instructor and operator level ipc courses for ipc a610, ipc jstd001, ipc a600, ipc whmaa620, and ipc 77117721 as well as customized classes to meet your specific standard or criteria for solder certification. Aug 20, 2019 in electronics manufacturing, printed circuit boards are separated into three categories. Issues of burnt flux on class 3 pcb assemblies eptac. Shown below are the minimum acceptable conditions for a class 3 platedthrough hole solder joint. Class 1 being least stringent to class 3 being most. Any class 3 solder connection failing to meet these minimum requirements should be considered a defect. External annular rings designing reliable inpad vias also requires that designers make decisions regarding annular rings on the interior and exterior layers of a pcb. Ipc jstd001 certified ipc trainer cit recertification program modules 1 5. Sep 03, 2014 the standards also cover class 2 platedthrough hole vertical solder fill requirements and class 2 flux activity criteria. Ipc a610 certification for ipc specialist cis ipc 610. Soldering training and ipc certification industrial insite. Pth3g throughhole solder joint quality standards from ipc.